The Microplastic Behavior of Several Precious Metal Electrical Contact Alloys
- 1 March 1975
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Parts, Hybrids, and Packaging
- Vol. 11 (1) , 29-35
- https://doi.org/10.1109/tphp.1975.1135033
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Materials for light-duty electrical contactsInternational Materials Reviews, 1970
- Some observations on microyielding in copper polycrystalsActa Metallurgica, 1969
- Microstrain Region and Transition to Macrostrain in 99.9% Polycrystalline CopperPhysica Status Solidi (b), 1967
- The effect of stacking fault energy on low temperature creep in pure metalsPhilosophical Magazine, 1958
- Transient Creep in Pure MetalsProceedings of the Physical Society. Section B, 1953