Rheological characterization of solder pastes for surface mount applications
- 1 November 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Packaging, and Manufacturing Technology: Part B
- Vol. 20 (4) , 416-423
- https://doi.org/10.1109/96.641510
Abstract
Accurate rheological measurements are needed in order to correlate the rheological behavior of solder pastes to their performance in the surface mount technology (SMT) process. In this paper, we summarize our efforts to measure the rheological properties of solder pastes, and outline the difficulties in obtaining their true rheological properties. In particular, we show that the rheological measurements of solder pastes are affected by "slip" at the test-apparatus surfaces and by shear fracture within the sample which have not been taken into consideration heretofore.Keywords
This publication has 11 references indexed in Scilit:
- A review of the slip (wall depletion) of polymer solutions, emulsions and particle suspensions in viscometers: its cause, character, and cureJournal of Non-Newtonian Fluid Mechanics, 1995
- Rheological characterization of solder pastesJournal of Electronic Materials, 1994
- Measuring the Flow Properties of Yield Stress FluidsAnnual Review of Fluid Mechanics, 1992
- Cone-and-plate rheometry of yield stress fluids. Study of an aqueous gelJournal of Non-Newtonian Fluid Mechanics, 1990
- Characterization of Particle Morphology and Rheological Behavior in Solder PasteIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987
- Rheology of Suspensions in Polymeric LiquidsJournal of Rheology, 1985
- Further observations on the rheological behaviour of dense suspensionsPowder Technology, 1984
- The measurement of the yield stress of liquidsRheologica Acta, 1982
- Rheology of concentrated dispersionsAdvances in Colloid and Interface Science, 1976
- The rheological properties of suspensions of rigid particlesAIChE Journal, 1976