Simulation of interconnection and package interaction phenomena in MMIC's by FDTD
- 30 December 2002
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 139-142
- https://doi.org/10.1109/epep.1993.394570
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- A technique for the fullwave automatic synthesis of waveguide components: application to fixed phase shiftersIEEE Transactions on Microwave Theory and Techniques, 1992
- Full-wave modeling of via hole grounds in microstrip by three-dimensional mode matching techniqueIEEE Transactions on Microwave Theory and Techniques, 1992