Twinning in copper electrodeposits
- 1 October 1959
- journal article
- Published by Elsevier in Acta Metallurgica
- Vol. 7 (10) , 700
- https://doi.org/10.1016/0001-6160(59)90160-9
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Twinned epitaxy of copper on copperJournal of Research of the National Bureau of Standards, 1958