Thick film hybrid packaging techniques for 500°C operation
- 27 November 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
No abstract availableThis publication has 2 references indexed in Scilit:
- Packaging Reliability for High Temperature Electronics: A Materials FocusMicroelectronics International, 1996
- A hybrid 6H-SiC temperature sensor operational from 25°C to 500°CIEEE Transactions on Components, Packaging, and Manufacturing Technology: Part A, 1996