Thermal fatigue evaluation of solder alloys. Final report
- 1 February 1980
- report
- Published by Office of Scientific and Technical Information (OSTI)
Abstract
An evaluation was made of the relative thermal fatigue resistance of 29 solder alloys. A number of these alloys were found to be less susceptible to thermal fatigue cracking in encapsulated printed wiring board applications than the commonly used tin-lead eutectic (63Sn-37Pb). Three alloys, 95Sn-5Ag, 96.5Sn-3.5Ag, and 95Sn-5Sb offered the greatest resistance to thermal fatigue. The selection of the encapsulation materials was confirmed to be a significant factor in thermal fatigue of solder joints, regardless of the solder alloy used.Keywords
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