Fall Impact Evaluating of Reliability of Solder Joints in BGA Packages Based on Surface Strain of Printed Wiring Board.
- 1 January 2003
- journal article
- Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
- Vol. 6 (1) , 73-79
- https://doi.org/10.5104/jiep.6.73
Abstract
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