Evaluation of Pb-free solders for adaptability to various soldering processes
- 1 January 1999
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
In this paper, the authors evaluated the efficiency and productivity of an SMT and iron-machine soldering process using Sn-Ag-Cu type solders. This solder is superior to conventional ones in terms of strength, heat fatigue resistance and toughness. The results obtained are as follows: (1) in SMT processes using Sn-Ag-Cu type solders, the quality of products and efficiency obtained are similar to conventional solders, when small electric parts are selected; and (2) in iron-machine soldering processes, Sn-Ag-Cu solder is similar to conventional solders when the iron temperature is high.Keywords
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