Precision flip-chip solder bump interconnects for optical packaging
- 1 January 1992
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 15 (6) , 977-982
- https://doi.org/10.1109/33.206920
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Solder joint reliability of fine pitch surface mount technology assembliesPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- LED array modules by new method micron bump bonding methodPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2003
- Optoelectronic component arrays for optical interconnection of circuits and subsystemsJournal of Lightwave Technology, 1991
- LED array modules by new technology microbump bonding methodIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1990