UV-LIGA process for high aspect ratio structure using stress barrier and C-shaped etch hole
- 31 July 2000
- journal article
- Published by Elsevier in Sensors and Actuators A: Physical
- Vol. 84 (3) , 342-350
- https://doi.org/10.1016/s0924-4247(00)00408-8
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- SU-8: a low-cost negative resist for MEMSJournal of Micromechanics and Microengineering, 1997