Strain and displacement measurements for microsystems technology

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Abstract
Two distinguished methods of tracking of natural or artificial surface structures have been utilized for deformation measurements in the microscopic domain. The first method regards classic speckle photography and involves Young's fringes evaluation, the second one bases on a direct cross correlation of structures by digital image processing means. Displacement and strain values are obtained within a regular data point grid automatically. Possible resolution limits for strain values are about 1 (DOT) 10-4. The typical displacement resolution is about 10 nm, but strongly depends on the structure imaging method. In order to use the measurement data together with numerical finite element simulations interfaces have been installed. The usefulness of the applied algorithms to problems in microtechnology is illustrated by a scanning electron microscope analysis of the complex solder deformation on surface mounted devices. Another example of application deals with the measurement of thermal expansion coefficients on adhesives of the electronics industry.

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