Plasma-assisted formation of low defect density silicon carbide-silicon dioxide, SiCSiO2, interfaces
- 1 June 1997
- journal article
- Published by Elsevier in Microelectronic Engineering
- Vol. 36 (1-4) , 73-76
- https://doi.org/10.1016/s0167-9317(97)00018-x
Abstract
No abstract availableKeywords
This publication has 5 references indexed in Scilit:
- Electron localization and noise in silicon carbide inversion layersPhilosophical Magazine Part B, 1996
- Characterization of annealed oxides on n-type 6HSiC by high- and low-frequency CV-measurementsMicroelectronic Engineering, 1995
- ARXPS studies of SiO2-SiC interfaces and oxidation of 6H SiC single crystal Si-(001) and C-(001) surfacesJournal of Materials Research, 1994
- Integration of Plasma-Assisted and Rapid Thermal Processing for Low-Thermal Budget Preparation of Ultra-Thin Dielectrics for Stacked-Gate Device StructuresJapanese Journal of Applied Physics, 1994
- Low-temperature preparation of SiO2/Si(100) interfaces using a two-step remote plasma-assisted oxidation-deposition processApplied Physics Letters, 1992