Bond‐Strength Measurements Related to Silicon Surface Hydrophilicity
- 1 August 1992
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 139 (8) , 2299-2301
- https://doi.org/10.1149/1.2221218
Abstract
The hydrophilicity level of commonly used surface treatments prior to silicon fusion bonding has been measured and related to a resulting bond strength. The necessity of hydrophilic silicon surfaces to yield a strong bond has been questioned, even counter‐proved. The strongest bonds measured were for hydrophobic, wafers annealed at 800°C.Keywords
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