Controlled collapse chip connection (C4)-an enabling technology
- 17 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Much of the technical information presented herein has been published by either IBM or Motorola This paper provides a higher-level view of the benefits, considerations and leverage applications of the C4 and DCA technologies. A key to acceptance and use of a new or different technology is its application in successful products. Although C4 is not new and has-been utilized extensively by IBM, it is different to Motorola. DCA is a relatively new technology and, thus, has a shorter history. As a foundation, this paper discusses the key C4 and DCA technical features and describes some initial product applications at Motorola. This linkage shows the enabling characteristics of the C4 flip-chip technology. Finally, future trends and directions of C4 and DCA technologies are discussed.Keywords
This publication has 1 reference indexed in Scilit:
- A hi-density C4/CBGA interconnect technology for a CMOS microprocessorPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002