Interfacial reaction in bimetallic Sn/Cu thin films
- 1 July 1980
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 70 (1) , 153-161
- https://doi.org/10.1016/0040-6090(80)90422-8
Abstract
No abstract availableKeywords
This publication has 8 references indexed in Scilit:
- Quantitative analysis of AlxGa1−xAs by Auger electron spectroscopyJournal of Vacuum Science and Technology, 1977
- Quantitative Auger analysis of ion-implanted boron and arsenic in polycrystalline siliconSurface Science, 1976
- Quantitative Auger electron spectroscopy using elemental sensitivity factorsJournal of Vacuum Science and Technology, 1976
- General formalism for quantitative Auger analysisSurface Science, 1975
- Quantitative auger analysis of copper-nickel alloy surfaces after argon ion bombardmentSurface Science, 1973
- Interdiffusion and reaction in bimetallic Cu-Sn thin filmsActa Metallurgica, 1973
- Interstitial Diffusion of Copper in TinJournal of Applied Physics, 1967
- Growth of whiskers in the solid phaseActa Metallurgica, 1958