A New Cyclic Biased T.H.B. Test for Power Dissipating IC's

• 1 April 1979
• conference paper
• Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium
• No. 07350791,p. 118-126
• https://doi.org/10.1109/irps.1979.362880

Abstract

Keywords

• CIRCUIT TESTING
• PLASTICS
• ABSORPTION
• MOISTURE MEASUREMENT
• TEMPERATURE
• ELECTRONIC EQUIPMENT TESTING
• INTEGRATED CIRCUIT TESTING
• CORROSION
• ALUMINUM
• ELECTRICAL RESISTANCE MEASUREMENT