On the Mechanism of Cathodic Crystal Growth Processes
Open Access
- 1 January 1961
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 108 (5) , 449-454
- https://doi.org/10.1149/1.2428109
Abstract
An electron diffraction and electron microscopic study on thin films of copper electrodeposited on clean 1 mil foils of copper and platinum from acid‐copper and complex copper‐glycine baths maintained at 25 °C has been conducted. The foils of copper and platinum consist of small grained structure. Results show that for a current density of 10 ma/cm2 and high acidic conditions (pH 0.3 or 0.9), large crystal grains of copper (10–40µ) are developed, even when the deposit thickness is very small. A limited study on the effect of current density on the orientation of nickel, electrodeposited mainly on brass disks from some common plating solutions maintained at 25 °C, has also been carried out. Results are discussed in light of existing mechanisms for the cathodic crystal growth process.Keywords
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