Passive assembly of parallel optical devices onto polymer‐based optical printed circuit boards

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Abstract
Purpose – The purpose of this paper is to present the latest results from research and development into future optical printed circuit board (OPCB) interconnects and low-cost assembly methods. Design/methodology/approach – A novel method of high-precision passive alignment and assembly to OPCBs was invented and a full evaluation platform developed to demonstrate the viability of this technique. Findings – The technique was successfully deployed to passively align and assemble a lens receptacle onto an embedded polymer waveguide array in an electro-OPCB. The lens receptacle formed a critical part of a dual lens pluggable in-plane connection interface between peripheral optical devices and an OPCB. A lateral in-plane mechanical accuracy of ±2?µm has been measured using this technique. Research limitations/implications – As this is a free space optical coupling process, surface scattering at the exposed waveguide end facet was significant. Originality/value – This paper details a novel method of passively assembling arbitrary optical devices onto multi-mode optical waveguides and outlines the procedure and equipment required. A lens coupling solution is also presented which reduces susceptibility of a connecting optical interface to contamination.