Temperature distribution on thin-film metallizations
- 1 May 1976
- journal article
- Published by AIP Publishing in Journal of Applied Physics
- Vol. 47 (5) , 1775-1779
- https://doi.org/10.1063/1.322890
Abstract
The time-dependent temperature distribution of a thin-film stripe has been solved rigorously using two successive Laplace transforms on both time and coordinate. For a good conducting stripe with a δ-shaped crack it is shown that the temperature distribution can be very adequately described by the steady-state solution provided only that the time scale involved is of the order of 10−3 sec or longer. No localized hot spot is possible, for whatever reasons, for a good conductor. However, if heat generation outpaces heat conduction, as would be the case for a poor conductor, a localized temperature becomes quite realizable. Finally, if stripe cracking is developed via grain-boundary grooving processes somewhere along the stripe, in particular near the anode, void formation there is simply a natural consequence of the temperature-grandient effect.This publication has 5 references indexed in Scilit:
- On the controversy about the direction of electrotransport in thin gold filmsApplied Physics Letters, 1975
- Temperature Distribution in a Cracked StripeJapanese Journal of Applied Physics, 1975
- On the direction of electromigration in gold thin filmsJournal of Applied Physics, 1975
- Cracked-Stripe Resistance and Current Crowding EffectJapanese Journal of Applied Physics, 1975
- Electromigration and metalization lifetimesJournal of Applied Physics, 1973