Board level reliability assessment of chip scale packages
- 1 September 1999
- journal article
- Published by Elsevier in Microelectronics Reliability
- Vol. 39 (9) , 1351-1356
- https://doi.org/10.1016/s0026-2714(99)00057-8
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Hitachi Ltd, JapanPump Industry Analyst, 1997
- Mini ball grid array (mBGA) assembly on MCM-L boardsPublished by Office of Scientific and Technical Information (OSTI) ,1997