Low Temperature Oxidation and Spalling of Electrodeposited and Vapour-Deposited Copper
- 1 January 1985
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Stress relief forms of diamond-like carbon thin films under internal compressive stressThin Solid Films, 1984
- On the mechanics of delamination and spalling in compressed filmsInternational Journal of Solids and Structures, 1984
- The oxidation of (100) single-crystal films of copper on (100) NaClThin Solid Films, 1972
- The role of oxide plasticity on the oxidation behavior of metals: A reviewOxidation of Metals, 1969