Differential thermal analysis using high frequency dielectric heating II. Curing kinetics studies

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Abstract
A previous paper described the theory and equipment of Differential Thermal Analysis using High Frequency Dielectric Heating, DTA/HF. Curing studies using DTA/HF on cis‐1,4‐polyisoprene rubber filled with 50 phr of CaCO3 and containing from 1.5 to 4.5 phr of dicumyl peroxide (DCP) curative indicated that below about 185°C, the curing reaction was first order with respect to DCP; the mean activation energy was 32.6 kcal/mole; and the heat of reaction ranged from 60 to 80 kcal/mole DCP. These results are in agreement with published results. Above 185°C both thermodynamic and kinetic evidence implied that the reaction mechanism changed; the first order peroxide decomposition no longer controlled the overall rate of reaction.The curing of both stereo styrene‐butadiene rubber (SBR) and cis‐1,4‐polybutadiene rubber (BR) containing 50 phr of CaCO3 and 0.5 phr of DCP was found to follow first order kinetics as expected. The magnitude of the heat of curing was used to determine the frequency of a vinyl propagation‐type cross‐linking reaction. Eight to 36 crosslinks per molecule of DCP were obtained. This reaction became more extensive at high temperature, in agreement with published results.

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