Electro-thermal circuit simulation using simulator coupling
- 1 September 1997
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Very Large Scale Integration (VLSI) Systems
- Vol. 5 (3) , 277-282
- https://doi.org/10.1109/92.609870
Abstract
The paper presents a methodology for simulating the static and dynamic performance of integrated circuits in the presence of electro-thermal interactions on the integrated circuit die. The technique is based on the coupling of a finite element method (FEM) program with a circuit simulator. In contrast to other known simulator couplings a time step algorithm is used, Its implementation in simulation tools is described. The thermal modeling of the die/package structure and the extended modeling of the electronic circuit is discussed. Simulation results which indicate the capabilities of the methodology for electro-thermal simulation are compared to experimental results.Keywords
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