Film Formation on Copper and Alpha Brass in Aqueous Cupric-Ammonia Systems

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Abstract
Reaction rates of single crystalline copper and α‐brass surfaces exposed to solutions of aqueous ammonia have been investigated. Composition of the precipitated films formed on the surfaces was investigated and attempts made to correlate film texture and composition with the mode of attack on the metal surfaces. An estimate of the activity coefficient of in concentrated aqueous could be made from the copper system data, and it is shown that film formation on brass occurred outside the limits defined in a general model of relative interfacial concentrations in the system. Also, it was observed that a thin film developed on α‐brass prior to tarnish formation. Nonhomogenous breakdown of this initial film, which was more protective than the tarnish layer, occurred by means other than mechanical rupture. Some applications of the data to stress related corrosion phenomena are discussed.
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