Effect of Cu Cored Ball in Solder Ball on Microstructure and Strength of BGA Joint.

• 1 January 1999
• journal article
• Published by Japan Institute of Electronics Packaging in Journal of The Japan Institute of Electronics Packaging
• Vol. 2  (4) , 298-302
• https://doi.org/10.5104/jiep.2.298

Abstract

Keywords

• MICROSTRUCTURE
• BGA JOINT
• SOLDER
• CU CORED BALL