Dependence of Channel Hot-Electron Injection on MOSFET Structure

Abstract
The dependence of channel hot-electron injection upon MOSFET structures is reported. Hot-electron injection, which is a serious constraint for MOSFETs scaled down to the 1 µm level, is directly evaluated by measuring gate current to as low as the order of 10-15 A. The measured gate current is modeled numerically, based on a thermionic emission equation for heated electron gas. In order to minimize hot-electron injection, three device structures are proposed: a graded drain structure; an offset gate structure; and a buried channel structure. The proposed device structures improve the highest applicable voltage, as limited by hot-electron injection, by as much as 1–2 V.

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