Comparison of Bosch and cryogenic processes for patterning high-aspect-ratio features in silicon

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Abstract
This paper compares the two leading techniques for etching deep into silicon, namely the `Bosch' process and a cryogenically cooled process. The Bosch process is introduced first. The process is described in some detail and details are given of particular hardware requirements. Finally, three classes of MEMS process are considered. For each application, relevant aspects of the Bosch process are discussed. Next, we more on to the `cryo' process. Again, this is described, together with hardware requirements. Three applications are presented for this process, with further comments relating to the process performance. Finally, in the conclusion, the two processes are compared and contrasted.

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