Ball grid array reliability assessment for aerospace applications

• 1 January 1999
• journal article
• Published by Elsevier in Microelectronics Reliability
• Vol. 39  (1) , 107-112
• https://doi.org/10.1016/s0026-2714(98)00185-1

Abstract

Keywords

• EXPERIENCE DESIGN
• WEIBULL DISTRIBUTION
• SCANNING ELECTRON MICROSCOPY
• DATA COLLECTION
• BALL GRID ARRAY
• CRACK PROPAGATION
• CROSS SECTION
• THERMAL CYCLING