Microstructure and mechanical properties of Sn-In and Sn-Bi solders

• 1 July 1993
• journal article
• lead free-solder
• Published by Springer Nature in JOM
• Vol. 45  (7) , 25-27
• https://doi.org/10.1007/bf03222376

Abstract

Keywords

• SHEAR BAND
• SOLDER JOINT
• TERTIARY CREEP
• EUTECTIC MICROSTRUCTURE
• ULTIMATE SHEAR STRESS