Low-stress encapsulation resin for VLSI
- 13 January 2003
- proceedings article
- Published by Institute of Electrical and Electronics Engineers (IEEE)
- p. 881-884
- https://doi.org/10.1109/ecc.1989.77849
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Internal stress of epoxy resin modified with acrylic core‐shell particles prepared by seeded emulsion polymerizationJournal of Applied Polymer Science, 1986