Investigation of Ta, TaN and TaSiN barriers for copper interconnects

• 20 January 2003
• proceedings article
• Published by Institute of Electrical and Electronics Engineers (IEEE)
• p. 125-127
• https://doi.org/10.1109/iitc.1999.787098

Abstract

Keywords

• TANTALUM
• XRD
• X RAY DIFFRACTION
• ARGON
• COPPER
• ANNEALING
• SURFACE TEXTURE
• ELECTROPLATING
• COMPRESSIVE STRESS
• MICROSTRUCTURE