A Mathematical Model for Chemical Vapor Deposition Processes Influenced by Surface Reaction Kinetics: Application to Low‐Pressure Deposition of Tungsten
- 1 May 1991
- journal article
- Published by The Electrochemical Society in Journal of the Electrochemical Society
- Vol. 138 (5) , 1523-1537
- https://doi.org/10.1149/1.2085820