Ceramics packaging with ferroelectric decoupling capacitor
- 4 December 2002
- conference paper
- Published by Institute of Electrical and Electronics Engineers (IEEE)
Abstract
Packaging is the most important application of ceramics in microelectronics. The continued evolution of ceramics and the processes with which the most advanced substrates will be fabricated are summarized. A discrete ferroelectric decoupling capacitor providing very low inductance to minimize the delta-I noise of ceramic packages is described.<>Keywords
This publication has 2 references indexed in Scilit:
- A low inductance capacitor technologyPublished by Institute of Electrical and Electronics Engineers (IEEE) ,2002
- Microelectronic PackagingScientific American, 1983