Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures
- 1 June 1979
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 2 (2) , 196-207
- https://doi.org/10.1109/tchmt.1979.1135444
Abstract
No abstract availableThis publication has 4 references indexed in Scilit:
- Corrosion of solder-coated TiPdAu thin film conductors in a moist chlorine atmosphereThin Solid Films, 1977
- Modern ElectrochemistryPublished by Springer Nature ,1970
- Screen printed capacitor dielectricsMicroelectronics Reliability, 1968
- Silver Migration in Electrical InsulationBell System Technical Journal, 1955