Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
- 1 December 1984
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 7 (4) , 314-327
- https://doi.org/10.1109/tchmt.1984.1136384
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Cast Leads for Surface AttachmentIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1984
- Thermal Deformations Observed in Leadless Ceramic Chip Carriers Surface Mounted to Printed Wiring BoardsIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1983
- Clad Metal Circuit Board Substrates for Direct Mounting of Ceramic Chip CarriersCircuit World, 1982