Moisture Resistance Degradation of Plastic LSIs by Reflow Soldering

1 March 1985

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE)

No. 07350791,p. 192-197
https://doi.org/10.1109/irps.1985.362097

Abstract

This paper presents the problems on LSIs that are mounted by reflow soldering method. The models for these problems and the evaluation method are presented. The structure and reliability data for the improved packages are presented.

Keywords

MOISTURE
DEGRADATION
REFLOW SOLDERING
PLASTIC PACKAGING
TEMPERATURE
SURFACE CRACKS
PACKAGING MACHINES
LARGE SCALE INTEGRATION
HEATING
GLASS

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