The Application of the Modified Electrostatic Model to the Diffusion of 3d-Impurities in Copper
- 1 January 1997
- journal article
- Published by Trans Tech Publications, Ltd. in Defect and Diffusion Forum
- Vol. 143-147, 137-142
- https://doi.org/10.4028/www.scientific.net/ddf.143-147.137
Abstract
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