Simultaneous dielectric and dynamic mechanical analysis of thermosetting polymers
- 1 March 1989
- journal article
- Published by Wiley in Polymer Engineering & Science
- Vol. 29 (5) , 278-284
- https://doi.org/10.1002/pen.760290503
Abstract
No abstract availableKeywords
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- In-situMeasurement of the Properties of Curing Systems with MicrodielectrometryThe Journal of Adhesion, 1982
- Developments in Polymer Characterisation—3Published by Springer Nature ,1982
- The interpretation of electrical resistivity measurements during epoxy resin cureJournal of Physics D: Applied Physics, 1968