A Reliable Heat Sink for Low Temperature Applications
- 1 October 1972
- journal article
- Published by AIP Publishing in Review of Scientific Instruments
- Vol. 43 (10) , 1538-1539
- https://doi.org/10.1063/1.1685485
Abstract
The thermal conductance of metallized ceramic heat sinks obtained from ``off-the-shelf'' electronic components at 4.2 and 77.3 K is reported. These metallized ceramics are good low temperature heat sinks, rugged and repeatedly soft-solderable, with a low electrical capacitance and very high electrical resistivity.Keywords
This publication has 3 references indexed in Scilit:
- Heat Capacity Measurements on Small Samples at Low TemperaturesReview of Scientific Instruments, 1972
- A Low Temperature Glass-Ceramic Capacitance ThermometerReview of Scientific Instruments, 1971
- Pyroelectric Thermometer for Use at Low TemperaturesReview of Scientific Instruments, 1969