Analyzing the mechanical strengths of SMT attached solder joints
- 1 January 1990
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 13 (3) , 553-558
- https://doi.org/10.1109/33.58858
Abstract
No abstract availableKeywords
This publication has 1 reference indexed in Scilit:
- Characterization of Particle Morphology and Rheological Behavior in Solder PasteIEEE Transactions on Components, Hybrids, and Manufacturing Technology, 1987