A New Moisture Sensor for "In-Situ" Monitoring of Sealed Packages

1 April 1977

conference paper
Published by Institute of Electrical and Electronics Engineers (IEEE) in 8th Reliability Physics Symposium

No. 07350791,p. 85-91
https://doi.org/10.1109/irps.1977.362776

Abstract

A new Al2O3 moisture sensor fabricated on an oxidized silicon wafer is described. The sensor responds to moisture levels down to 1 ppmv and is used to nondestructively determine the water level inside sealed hybrid packages. Device performance characteristics are given. Preliminary results are reported for these devices sealed in hybrid packages at several manufacturing locations.

Keywords

MONITORING
SENSOR PHENOMENA AND CHARACTERIZATION
SEMICONDUCTOR DEVICE PACKAGING
FAILURE ANALYSIS
MICROELECTRONICS
CURRENT MEASUREMENT
MOISTURE MEASUREMENT
TEMPERATURE SENSORS
MASS SPECTROSCOPY
GOLD

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