High/Low Modulus Si3N4‐BN Composite for Improved Electrical and Thermal Shock Behavior
- 1 July 1981
- journal article
- Published by Wiley in Journal of the American Ceramic Society
- Vol. 64 (7) , 415-419
- https://doi.org/10.1111/j.1151-2916.1981.tb09881.x
Abstract
No abstract availableKeywords
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