Molecular packing and free volume in crosslinked epoxy networks
- 1 January 1991
- Vol. 32 (10) , 1875-1884
- https://doi.org/10.1016/0032-3861(91)90379-w
Abstract
No abstract availableKeywords
This publication has 38 references indexed in Scilit:
- Anomalous behavior of cured epoxy resins: Density at room temperature versus time and temperature of cureJournal of Applied Polymer Science, 1989
- Epoxy Molding Compounds as Encapsulation Materials for Microelectronic DevicesPublished by Springer Nature ,1989
- The effects of stoichiometry and structure on the dynamic torsional properties of a cured epoxy resin systemJournal of Macromolecular Science, Part B, 1984
- Structure-property relations of polyethertriamine-cured bisphenol-A-diglycidyl ether epoxiesPolymer, 1984
- Effect of the extent of cure on the modulus, glass transition, water absorptio, and density of an amine-cured epoxyJournal of Applied Polymer Science, 1983
- Oxygen transmission through highly crosslinked polymersPolymer Engineering & Science, 1980
- Effect of absorbed water on the thermal relaxation of biaxially stretched crosslinked poly(methyl methacrylate)Polymer, 1979
- Tensile, impact and fatigue behavior of an amine‐cured epoxy resinPolymer Engineering & Science, 1978
- Effect of cross‐linking on hydrostatic creep of epoxyPolymer Engineering & Science, 1977
- Fracture toughness and mechanical behaviour of an epoxy resinJournal of Materials Science, 1975