Reactive ion plating (RIP) with auxiliary discharge and the influence of the deposition conditions on the formation and properties of TiN films
- 1 November 1979
- journal article
- Published by Elsevier in Thin Solid Films
- Vol. 63 (2) , 347-356
- https://doi.org/10.1016/0040-6090(79)90039-7
Abstract
No abstract availableKeywords
This publication has 3 references indexed in Scilit:
- Interaction of oxygen and nitrogen with clean transition metal surfacesSurface Science, 1978
- Applications of wear-resistant thick films formed by physical vapor deposition processesThin Solid Films, 1977
- Adhesion of Ion Plated Films and Energies of DepositionThe Journal of Adhesion, 1977