Abstract
The dose dependence and annealing of lateral strains induced by 80 keV argon implants in silicon have been studied by X-ray interferometry and X-ray diffraction topography in the range 1014-1017 ions/cm2 and 20–900°C, respectively. Volume expansion has been observed in the as-implanted state, but for bombardment to doses much larger than that required to produce an amorphous layer, an essentially stress-free state is obtained. Annealing at 600°C results in a stress-free state for all doses considered. Samples implanted up to doses required to form an amorphous layer, and slightly higher, show a rapid reverse-annealing above 600°C, accompanied by a reversal of sign of the strain.

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