Spatial distribution of sputtered atoms from magnetron source

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Abstract
The macroscopic distribution of atomic material leaving a magnetically enhanced sputtering source is described for dissimilar materials and for different target grain structures. This information is useful to the thin-film process engineer and the magnetron designer. Results obtained give data on the flux of material sputtered from different areas of the target. A 110-mm-diam planar magnetron is used, powered by a 5-kW dc supply in an Edwards ESM100 coating system. Al and Cu electrodes, 6.35 mm thick, are sputtered at 5×10−3 mbar in argon. Profilometric data are obtained from pinhole camera deposited images of the magnetron surface. Direct images of the sputtered atoms leaving the cathode surface are obtained by collecting them on glass substrates after passing through a small aperture in a manner analogous to a pinhole camera. Thickness distribution is measured by a Rank Taylor Hobson Talystep. By collecting data from such images the atomic emissions from points on the magnetron surface are quantified. Improvements in thickness distribution are made by calculating mask dimensions from these data.

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