The Effect of Gold-Tin Intermetallic Compound on the Low Cycle Fatigue Behavior of Copper Alloy C72700 and C17200 Wires
- 1 September 1986
- journal article
- Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Transactions on Components, Hybrids, and Manufacturing Technology
- Vol. 9 (3) , 272-278
- https://doi.org/10.1109/tchmt.1986.1136650
Abstract
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