The Effect of Cu Distribution on Post-Patterning Grain Growth and Reliability of Al-1%Cu Interconnects
- 1 January 1995
- journal article
- Published by Springer Nature in MRS Proceedings
Abstract
No abstract availableKeywords
This publication has 2 references indexed in Scilit:
- Effects of microstructure on interconnect and via reliability: Multimodal failure statisticsJournal of Electronic Materials, 1993
- Kirkendall study of electromigration in thin filmsThin Solid Films, 1975