Effect of substrate surfaces and heat treatments on adhesion of Cu films
- 1 August 1997
- journal article
- Published by Elsevier in Materials Letters
- Vol. 32 (2-3) , 185-189
- https://doi.org/10.1016/s0167-577x(97)00024-4
Abstract
No abstract availableKeywords
This publication has 4 references indexed in Scilit:
- Materials Issues in Copper InterconnectionsMRS Bulletin, 1994
- Advanced multilayer metallization schemes with copper as interconnection metalThin Solid Films, 1993
- Formation of Copper Thin Films by a Low Kinetic Energy Particle ProcessJournal of the Electrochemical Society, 1991
- Low-resistivity Cu thin-film deposition by self-ion bombardmentApplied Physics Letters, 1990