Some reliability problems of surface-mounted devices

1 July 1988

journal article
Published by Institute of Electrical and Electronics Engineers (IEEE) in IEEE Circuits and Devices Magazine

Vol. 4 (4) , 9-13
https://doi.org/10.1109/101.20777

Abstract

The general characteristics of suitable SMT (surface mount technology) substrates are outlined, and various substrate materials are considered. Adhesion between devices and substrates is discussed. In particular, the effects of cycle strains and stresses, problems related to solder and contact metals, and electromigration problems are examined.

Keywords

THERMAL CONDUCTIVITY
CERAMICS
SUBSTRATES
SURFACE-MOUNT TECHNOLOGY
CONDUCTING MATERIALS
THERMAL RESISTANCE
POWER DISSIPATION
ELECTRONIC EQUIPMENT
ASSEMBLY
INORGANIC MATERIALS

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